Simulation of metal droplet deposition with solidification including undercooling and contact resistance effects

Numerical Heat Transfer; Part A: Applications

Volumn 37, Issue 3, 2000, Pages 201-226

  Chung, M ^a   Rangel, R H ^a  

^a University of California at Irvine   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000113405     PISSN: 10407782     EISSN: 15210634     Source Type: Journal    
DOI: 10.1080/104077800274262     Document Type: Article

References (26)

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