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Volumn 605, Issue , 2000, Pages 235-240
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Temperature-dependent coefficient of thermal expansion of silicon nitride films used in microelectromechanical systems
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Author keywords
[No Author keywords available]
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Indexed keywords
CANTILEVER BEAMS;
DEFLECTION (STRUCTURES);
ELASTIC MODULI;
HIGH TEMPERATURE EFFECTS;
IMAGE ANALYSIS;
MATHEMATICAL MODELS;
MECHANICAL VARIABLES MEASUREMENT;
MICROELECTRONIC PROCESSING;
THERMAL EXPANSION;
THERMOMECHANICAL TREATMENT;
THIN FILMS;
COEFFICIENT OF THERMAL EXPANSION;
MICROELECTROMECHANICAL SYSTEMS;
SILICON NITRIDE FILM;
THERMAL PROCESSING;
SILICON NITRIDE;
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EID: 0034516548
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (5)
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