Effect of microstructure on high-temperature compressive creep of self-reinforced hot-pressed silicon nitride

Journal of the American Ceramic Society

Volumn 83, Issue 12, 2000, Pages 3065-3069

  Boling Risser, Martha A ^a,b   Goretta, K C ^a   Routbort, J L ^a   Faber, K T ^b  

^a ARGONNE NATIONAL LABORATORY   (United States)

^b Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPRESSION TESTING; CREEP; CRYSTAL MICROSTRUCTURE; DEFORMATION; GRAIN BOUNDARIES; HIGH TEMPERATURE PROPERTIES; HOT PRESSING; PRECIPITATION (CHEMICAL); REINFORCEMENT; STRESSES;

HIGH TEMPERATURE COMPRESSIVE CREEP; HIGH TEMPERATURE MECHANISMS; SELF REINFORCED HOT PRESSED SILICON NITRIDE; SOLUTION REPRECIPITATION; TWO GRAIN JUNCTIONS;

SILICON NITRIDE;

EID: 0034504309     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2000.tb01683.x     Document Type: Article

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