Characterization of low temperature, wafer-level gold-gold thermocompression bonds

Materials Research Society Symposium - Proceedings

Volumn 605, Issue , 2000, Pages 171-176

  Tsau, Christine H ^a   Schmidt, Martin A ^b   Spearing, S Mark ^a  

^a USA   (United States)

^b Department of Electrical Engineering and Computer Science   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION PROTECTION; CRACK PROPAGATION; DELAMINATION; ELECTRONICS PACKAGING; FRACTURE TOUGHNESS; LOW TEMPERATURE EFFECTS; MICROELECTROMECHANICAL DEVICES; OXIDATION RESISTANCE; PLASTIC DEFORMATION; PRESSURE; SEMICONDUCTOR DEVICE MODELS; STRAIN RATE;

DIE BONDING; THERMOCOMPRESSION BONDING; VACUUM SEALING; WAFER LEVEL BONDING;

GOLD;

EID: 0034498678     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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