Synthesis and properties of a low hygrothermal stress epoxy molding compound for electronic encapsulation

Polymer Composites

Volumn 21, Issue 6, 2000, Pages 953-959

  Wang, J B ^a   Chou, Hui Lung ^a  

^a I SHOU UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSLINKING; DIFFUSION IN SOLIDS; ELASTIC MODULI; ENCAPSULATION; MOISTURE; PLASTICS MOLDING; SHRINKAGE; SILICONES; STRAIN; SYNTHESIS (CHEMICAL); THERMAL EXPANSION; THERMAL STRESS;

HYGROTHERMAL STRESS; THERMAL EXPANSION COEFFICIENT; THERMAL MISMATCH;

EPOXY RESINS;

EID: 0034487075     PISSN: 02728397     EISSN: None     Source Type: Journal    
DOI: 10.1002/pc.10248     Document Type: Article

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