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Advanced Metallization Conference (AMC)

Volumn , Issue , 2000, Pages 477-481

3-D time-depending electro- and thermomigration simulation of metallization structures

(2) Dalleau, D a Weide Zaage, K a

a Lab fur Informationstechnologie (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CURRENT DENSITY; ELECTROMIGRATION; FINITE ELEMENT METHOD; NUMERICAL METHODS; SCANNING ELECTRON MICROSCOPY;

TIME TO FAILURE (TTF) VALUE;

METALLIZING;

EID: 0034462055 PISSN: 10480854 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (2)

References (9)

1
- 0030381116
- Numerical simulation of surface diffusion controlled Motion and shape change of electromigration voids
- (1996) MRS Proceedings , vol.428 , pp. 161
- Kraft, O.¹ Möckl, U.E.² Arzt, E.³

2
- 0005526443
- MRS, Spring
- (1997) 3-D Finite Element Simulation of Electro and Stress Migration effects in Interconnect lines
- Rzepka, S.¹ Korhonen, M.A.² Weber, E.R.³ Li, C.-Y.⁴

3
- 0005566313
- MRS, Boston
- (1998) Finite element Analysis of thermal-mechanical stress induced failure in an aluminium meander structure
- Yu, X.¹ Weide, K.²

4
- 4244152785
- SPIE Austin, Texas
- (1997) Investigations of mechanical stress and electromigration in aluminum meander structure
- Yu, X.¹ Weide, K.²

5
- 0003432018
- Plenum Pub.
- (1970) Thermophysical properties of Matter , vol.1-2
- Touloukian, Y.S.¹

6
- 0012784493
- Berlin
- (1972) Elektro- und Thermotranstort in Metallen
- Wever, H.¹

7
- 0003489118
- (1998) Diffusion phenomena in thin films and Microelectronic Materials
- Gupta, D.¹ Ho, P.S.²

8
- 0022162760
- Electromigration mechanisms in aluminum lines
- (1985) Solid state Electronics , vol.28 , Issue.11 , pp. 1153-1163
- Schreiber, H.-U.¹

9
- 0005564036
- Diploma Thesis, University Hannover
- (1995) Untersuchung zur Zuverlässigkeit von Metallisierungsstrukturen
- Yu, X.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.