TEM/SEM investigation and electrical evaluation of a bottomless I-PVD Ta(N) barrier in dual damascene

Advanced Metallization Conference (AMC)

Volumn , Issue , 2000, Pages 279-285

  Yamagishi, H ^a   Tokei, Zs ^a   Beyer, G P ^a   Donaton, R ^a   Bender, H ^a   Nogami, T ^a   Maex, K ^a  

^a SONY CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELECTROMIGRATION; IONIZATION; PHYSICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SCHEMATIC DIAGRAMS; SPUTTER DEPOSITION; TRANSMISSION ELECTRON MICROSCOPY;

DUAL DAMASCENE;

COPPER;

EID: 0034460826     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)