Optimising process parameters for flip chip stencil printing using Taguchi's method

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2000, Pages 382-388

  Rajkumar, D ^a   Nguty, T ^a   Ekere, N N ^a  

^a UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

PRESSURE EFFECTS; PRINTING; SEMICONDUCTOR DEVICE MODELS; SPEED; SURFACE MOUNT TECHNOLOGY;

FLIP CHIP STENCIL PRINTING; TAGUCHI METHOD;

FLIP CHIP DEVICES;

EID: 0034448410     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Solder paste printing guidelines for BGA and CSP assemblies
2. Modelling of the paste withdrawal sub-process in the stencil printing of solder pastes for the reflow soldering of surface mount assemblies
3. Surface mount technology with fine pitch components
4. The future of solder paste printing for SMT reflow soldering
5. Predicting scooping and skipping in solder paste printing for reflow soldering of SMT devices
6. Parameter interactions in stencil printing of solder paste
7. Prospects of solder paste in ultra fine pitch era
8. Taguchi design of experiment of wafer bumping by stencil printing