Taguchi design of experiment for wafer bumping by stencil printing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1705-1711

  Lau, John ^a   Chang, Chris ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; PRINTING; SEMICONDUCTOR DEVICE MODELS; SOLDERING; SURFACE MOUNT TECHNOLOGY;

ANALYSIS OF MEAN; ANALYSIS OF VARIANCE; STENCIL PRINTING; TAGUCHI DESIGN; WAFER BUMPING;

SILICON WAFERS;

EID: 0034480265     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)