Extraction of accurate package models from VNA measurements

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2000, Pages 55-59

  Huang, Ching Chao ^a   Chia, Ben ^a   Sarfaraz, Ali ^a   Fox, Michael J ^a  

^a RAMBUS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC NETWORK ANALYZERS; MATHEMATICAL MODELS; SCATTERING PARAMETERS; TRANSMISSION LINE THEORY;

BALL GRID ARRAY PACKAGE; SOFTWARE PACKAGE HSPICE; VECTOR NETWORK ANALYZER;

ELECTRONICS PACKAGING;

EID: 0034448108     PISSN: 10898190     EISSN: None     Source Type: Journal    
DOI: 10.1109/IEMT.2000.910708     Document Type: Article

References (3)

1. Measurement of package inductance and capacitance matrices
2. Microwave transistor amplifiers: Analysis and design
3. Coupled lossy transmission line characterization and simulation