A study on CVD TaN as a diffusion barrier for Cu interconnects

Materials Research Society Symposium - Proceedings

Volumn 612, Issue , 2000, Pages

  Im, S J ^a   Kim, S H ^a   Park, K C ^a   Cho, S L ^a   Kim, K B ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ANNEALING; DIFFUSION IN GASES; FILM GROWTH; ION BEAMS; ION BOMBARDMENT; X RAY DIFFRACTION ANALYSIS;

DIFFUSION BARRIERS;

METALLIC FILMS;

EID: 0034431005     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-612-d6.7.1     Document Type: Conference Paper

References (10)