Electromigration reliability of dual-damascene Cu/oxide interconnects

Materials Research Society Symposium-Proceedings

Volumn 612, Issue , 2000, Pages D231-D236

  Ogawa, Ennis T ^a   Bierwag, Alex ^a   Lee, Ki Don ^a   Matsuhashi, Hideki ^a   Ramamurthi, Anup ^a   Justison, Patrick R ^a   Ho, Paul S ^a   Blaschke, Volker A ^b   Griffiths, David ^b   Havemann, Robert H ^b  

^a The University of Texas at Austin   (United States)

^b SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CURRENT DENSITY; ELECTROMIGRATION; FAILURE ANALYSIS; IMAGING TECHNIQUES; ION BEAMS; RELIABILITY THEORY;

CUMULATIVE FAILURE DISTRIBUTIONS (CFD); FAILURE MODES;

COPPER OXIDES;

EID: 0034430645     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-612-d2.3.1     Document Type: Article

References (6)