Curing study of hydrogen silsesquioxane under H2/N2 ambient

Materials Research Society Symposium - Proceedings

Volumn 612, Issue , 2000, Pages

  Liou, H C ^a   Dehate, E ^a   Duel, J ^a   Dall, F ^a  

^a DOW CORNING CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; ELASTIC MODULI; HIGH TEMPERATURE EFFECTS; HYDROGEN; MICROELECTRONICS; NITROGEN; OXIDATION; PERMITTIVITY; THIN FILMS;

HYDROGEN SILSESQUIOXANE (HSQ);

HYDROGEN INORGANIC COMPOUNDS;

EID: 0034428451     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-612-d5.12.1     Document Type: Conference Paper

References (7)