Material properties of a SiOC low dielectric constant film with extendibility to k<2.7

Materials Research Society Symposium-Proceedings

Volumn 612, Issue , 2000, Pages D531-D537

  Lopata, Eugene S ^a   Young, Lydia ^b   Felts, John T ^c  

^a Silicon Valley Group   (United States)

^b KLA TENCOR CORPORATION   (United States)

^c Nano Scale Surface Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; HARDNESS; PERMITTIVITY; SEMICONDUCTING FILMS; SILICON COMPOUNDS; THERMODYNAMIC STABILITY;

INTERLAYER DIELECTRIC (ILD) FILMS;

DIELECTRIC FILMS;

EID: 0034428208     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-612-d5.3.1     Document Type: Article

References (4)

1. Low-dielectric constant materials V