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Volumn 37, Issue 6, 2000, Pages 878-881
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Improvement of silicon direct bonding using surfaces activated by hydrogen plasma treatment
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0034347674
PISSN: 03744884
EISSN: None
Source Type: Journal
DOI: 10.3938/jkps.37.878 Document Type: Article |
Times cited : (8)
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References (10)
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