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Volumn 37, Issue 6, 2000, Pages 878-881

Improvement of silicon direct bonding using surfaces activated by hydrogen plasma treatment

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0034347674     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: 10.3938/jkps.37.878     Document Type: Article
Times cited : (8)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.