Modeling and evaluation criterion for thermocompression flip-chip bonding

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 652-660

  McLaren, Timothy S ^a,b   Lee, Yung Cheng ^c  

^a UNIVERSITY OF COLORADO   (United States)

^b Washington State University   (United States)

^c University of Colorado at Boulder   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND JOINT FORMATION; FLIP-CHIP BONDING; THERMOCOMPRESSION;

FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MULTICHIP MODULES; PLASTIC DEFORMATION; SOLDERED JOINTS; STRAIN; STRESS CONCENTRATION;

BONDING;

EID: 0034315835     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883755     Document Type: Article

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