Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

Solid State Technology

Volumn 43, Issue 11, 2000, Pages 125-130

  Wyant, J L ^a,c   Schuckert, C C ^b,d  

^a Delphi Delco Electronic Systems   (United States)

^b HD MicroSystems   (United States)

^c DELPHI CORPORATION   (United States)

^d NONE

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; CHEMICAL RESISTANCE; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; METALLIZING; MOLDING; PASSIVATION; POLYIMIDES; SILICON NITRIDE;

POLYMER COATINGS; STRESS BUFFER PASSIVATION;

ELECTRONICS PACKAGING;

EID: 0034315521     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. S. Hall, C. Schuckert, "Single Mask Wafer Overcoat Process Using Photodefinable Polyimide," Solid State Technology, pp. 95-96, October 1999.
2. J. Colburn, M. Pottiger, "The Influence of Processing Conditions on Structure, Properties and Stress Development in Spin Coated Polyimide Films," Advances in Polyimide Science and Technology Proceedings, pp. 360-374, 1991.
3. P. Magill, D. Mis, R. Lanzone, "Contract Manufacturing and FC Interconnect Design," HDI: The Magazine of High-Density Interconnect, pp. 38-41, March 2000.