Analytical-based solutions for SCALPEL wafer heating

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 6, 2000, Pages 3115-3121

  Fares, N ^a   Stanton, S ^b   Liddle, J ^b   Gallatin, G ^b  

^a Imagineering LLC   (United States)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; DEFORMATION; FINITE ELEMENT METHOD; GREEN'S FUNCTION; HEAT TRANSFER; HEATING; PROJECTION SYSTEMS; STRAIN;

PROJECTION ELECTRON IMAGING;

ELECTRON BEAM LITHOGRAPHY;

EID: 0034314802     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1319839     Document Type: Article

References (7)

1. S. Stanton, J. Liddle, G. Gallatin, B. Kim, and R. Engelstad, Microelectron. Eng. 46, 235 (1999).
2. B. A. Boley and J. H. Weiner, Theory of Thermal Stresses (Wiley, New York, 1960).
3. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids (Oxford Science, Oxford, 1959).
4. N. M. Ozisik, Boundary Value Problems of Heat Conduction (International Textbook Company, 1968).
5. J. V. Beck, K. D. Cole, A. Haji-Sheikh, and B. Litkouhi, Heat Conduction Using Green's Functions (Hemisphere, 1992).
6. N. I. Muskhelishvili, Some Basic Problems of the Mathematical Theory of Elasticity (Noordhoff, The Netherlands, 1963).
7. N. Fares, Ph.D. thesis, MIT, 1987.