The effect of multilayer patterns on temperature uniformity during rapid thermal processing

Journal of the Electrochemical Society

Volumn 143, Issue 3, 1996, Pages 1142-1151

  Hebb, Jeffrey P ^a   Jensen, Klavs F ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SEMICONDUCTING SILICON; SEMICONDUCTOR MATERIALS; SILICON WAFERS; TEMPERATURE;

ELECTROMAGNETIC MULTILAYER THEORY; RAPID THERMAL PROCESSING; TEMPERATURE UNIFORMITY; TITANIUM SILICIDATION;

MULTILAYERS;

EID: 0030105421     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836598     Document Type: Article

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