Adhesion of copper on polyimide deposited by arc-enhanced deposition

Surface and Coatings Technology

Volumn 133-134, Issue , 2000, Pages 425-429

  Lux, T ^a  

^a FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING AND AUTOMATION IPA   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANODIC OXIDATION; CARRIER CONCENTRATION; COPPER; IONIZATION OF SOLIDS; PLASTIC FILMS; POLYIMIDES;

ANODIC ARC CURRENTS; ARC-ENHANCED DEPOSITION; ION PLATING;

PROTECTIVE COATINGS;

POLYIMIDE;

EID: 0034310635     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(00)00897-5     Document Type: Article

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