Improvement of the adhesion to polyimide substrates of copper films prepared by an ion beam and vapor deposition (IVD) method

Thin Solid Films

Volumn 281-282, Issue 1-2, 1996, Pages 356-359

  Ebe, Akinori ^a   Takahashi, Eiji ^a   Iwamoto, Yasushi ^a   Kuratani, Naoto ^a   Nishiyama, Satoshi ^a   Imai, Osamu ^a   Ogata, Kiyoshi ^a   Setsuhara, Yuichi ^b   Miyake, Shoji ^b  

^a NISSIN ELECTRIC CO LTD   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Adhesion; Copper; Ion beam and vapour deposition; Polyimide

Indexed keywords

ADHESION; CARBONIZATION; COPPER; DIFFUSION; EVAPORATION; ION BEAMS; ION BOMBARDMENT; POLYIMIDES; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY; VAPOR DEPOSITION; X RAY PHOTOELECTRON SPECTROSCOPY;

ANCHOR EFFECT; COPPER ATOMS; COPPER FILMS; NITROGEN IONS;

THIN FILMS;

EID: 0030218378     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(96)08629-4     Document Type: Article

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