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0343188452
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Moisture induced failures of plastic packages of IC devicesstate of the art and crucial needs
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EEP- New York: ASME
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0027962180
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Recent developments in the laser spallation technique to measure the interface strength and its relationship to interface toughness with applications to metal/ceramic, ceramic-ceramic and ceramic-polymer interfaces
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Measurement of thin film interface toughness by laser-generated stress pulses
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Pronin, A.N.1
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The Mechanical performance of fiber-reinforced ceramic matrix composites
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Interfaces with controlled toughness as mechanical fuses to isolate fiber damage
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Gupta, V.1
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7
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0029255053
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The effect of microstructure and chemistry on the tensile strength of Nb/Sapphire interfaces, with and without the interlayers of Cr and Sb
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Yuan J., Gupta V. The effect of microstructure and chemistry on the tensile strength of Nb/Sapphire interfaces, with and without the interlayers of Cr and Sb. Acta Metall Mater. 43(2):1994;781-794.
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Structure and chemistry of Nb/Sapphire interfaces, with and without the interlayers of Sb and Cr
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Yuan J., Gupta V., Kim M. Structure and chemistry of Nb/Sapphire interfaces, with and without the interlayers of Sb and Cr. Acta Metall Mater. 43(2):1995;769-780.
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Yuan, J.1
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9
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0006331435
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Response to the comments of Nutt and King on the bond strength measurements
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Argon A.S., Cornie J.A., Gupta V., Lev L., Parks D.M. Response to the comments of Nutt and King on the bond strength measurements. Mater Sci Engng. A 237:1997;224-228.
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10
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85031568298
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Tensile strength of nitride/polyimide interface and its degradation due to moisture segregation with implications for device reliability
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submitted for publication
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Gupta V, Hernandez R. Tensile strength of nitride/polyimide interface and its degradation due to moisture segregation with implications for device reliability. Mater Sci Engng, 2000, submitted for publication.
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Gupta, V.1
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