Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4′-diaminodiphenylmethane

Journal of Applied Polymer Science

Volumn 78, Issue 4, 2000, Pages 794-799

  Gao, Jungang ^a   Li, Yanfang ^a   Zhao, Min ^a   Liu, Guodong ^a  

^a HEBEI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; GLASS TRANSITION; MOLECULAR STRUCTURE; PARAFFINS; PYROLYSIS; REACTION KINETICS; THERMAL EFFECTS;

DIAMINOPHENYLMETHANE;

EPOXY RESINS;

EID: 0034299923     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/1097-4628(20001024)78:4<794::AID-APP120>3.0.CO;2-H     Document Type: Article

References (16)

1. Pang, K. P.; Gillham, J. K. J Appl Polym Sci 1990, 39, 909.
2. Liu, Z. H. Thermoanalysis Introduction: Chemical Industry Publishing Co.: Beijing, 1991.
3. Liaw, D. J.; Shen, W. C. Angew Makromol Chem 1992, 199, 171.
4. Bansal, R. K.; Agarwal, R.; Keshav, K. Angew Makromol Chem 1979, 79, 125.
5. Masters, J. E. U.S. Pat. 2,767,157 (1956).
6. Gao, J. G.; Liu, Y. H.; Wang, F. L.; Shi, L. Q. Technol Adhes Sealing 1986, 7, 5.
7. Gao, J. G. J Appl Polym Sci 1993, 48, 237.
8. Rainer, E.; Udo, G.; Heinrich, H. W.; Eruin, B. Ger. Pat. DD 228,279 (1985).
9. Jay, R. R. Anal Chem 1964, 36, 665.
10. Simon, S. L.; Gillham, J. K. J Appl Polym Sci 1993, 47, 461.
11. Wisanrakkit, G.; Gillham, J. K. J Appl Polym Sci 1990, 41, 2885.
12. Wisanrakkit, G.; Gillham, J. K.; Enns, J. B. J Appl Polym Sci 1990, 41, 1895.
13. Venditti, R. A.; Gillham, J. K. J Appl Polym Sci 1997, 64, 3.
14. Li, Y. F.; Shen, S. G.; Liu, Y. F.; Gao, J. G. J Appl Polym Sci 1999, 73, 1799.
15. Gao, J. G.; Wang, F. L. Chem. J. Chin Univ, 1987, 8, 572.
16. Masuo, M.; Satoru, O.; Sumitomo Baketite Co. Ltd. Jpn. Pat. 91,143,980(1991).