Strength and ductility of heavily drawn bundled Cu-Nb filamentary microcomposite wires with various Nb contents

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 31, Issue 10, 2000, Pages 2457-2462

  Hong, S I ^a   Hill, M A ^b   Kim, H S ^a  

^a Chungnam National University   (South Korea)

^b LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DUCTILITY; GRAIN BOUNDARIES; NIOBIUM; STRENGTHENING (METAL); VOLUME FRACTION; YIELD STRESS;

FILAMENTARY MICROCOMPOSITES; HALL PETCH INTERACTION; PHASE BOUNDARIES;

METALLIC MATRIX COMPOSITES;

EID: 0034297858     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-000-0191-2     Document Type: Article

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