New lateral field emission device using chemical-mechanical polishing

IEEE Electron Device Letters

Volumn 21, Issue 10, 2000, Pages 479-481

  Lee, Choon Sup ^a   Lee, Jae Duk ^a,b   Han, Chul Hi ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; ELECTRODES; SEMICONDUCTING SILICON;

CHEMICAL MECHANICAL POLISHING (CMP); FOWLER-NORDHEIM (FN) EQUATIONS; POLYSILICON;

SEMICONDUCTOR MATERIALS;

EID: 0034297688     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.870607     Document Type: Article

References (8)

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