Growth kinetics of Cu-Sn intermetallic compounds at interface of 80Sn-20Pb electrodeposits and Cu based leadframe alloy, and its influence on the fracture resistance to 90°-bending

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 39, Issue 10, 2000, Pages 6067-6073

  Suh, Min Suk ^a   Kwon, Hyuk Sang ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COPPER ALLOYS; CRACKS; DIFFUSION; ELECTRIC CURRENTS; ELECTRODEPOSITION; FRACTURE; GRAIN BOUNDARIES; GROWTH KINETICS; MICROSTRUCTURE; SOLUTIONS; TIN;

COPPER BASED LEADFRAME ALLOY; FRACTURE RESISTANCE; ORGANIC SULFONATE SOLUTION; PULSE CURRENT; SUBSTRATE INTERFACE;

INTERMETALLICS;

EID: 0034291892     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.39.6067     Document Type: Article

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