Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 5, 2000, Pages 2312-2318

  Mu, Haicuan ^a   Yu, Yuehui ^a   Luo, E Z ^b   Sundaravel, B ^b   Wong, S P ^b   Wilson, I H ^b  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FILM PREPARATION; ION BEAMS; SEMICONDUCTING SILICON; SPUTTER DEPOSITION; THERMAL DIFFUSION IN SOLIDS; THERMODYNAMIC STABILITY; THIN FILMS; TITANIUM; TITANIUM NITRIDE;

ION BEAM ASSISTED DEPOSITION (IBAD);

METALLIC FILMS;

EID: 0034275608     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1288942     Document Type: Article

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