Single-wafer wet cleaning improved by novel high-performance wafer drying

Solid State Technology

Volumn 43, Issue 9, 2000, Pages 113-118

  Mertens, Paul W ^a,b   Marent, Katrien ^a  

^a IMEC   (Belgium)

^b CMOS Device Research Group   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL CLEANING; CHEMICAL POLISHING; COMPUTER SIMULATION; COPPER; DRYING; ELECTROPLATING; OPTICAL MICROSCOPY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

CHEMICAL MECHANICAL POLISHING; PARTICLE ADDITION CONTROL; ROTAGONI WAFER DRYING; SPIN DRYING; WAFER WET CLEANING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034273734     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. P. Kücher, "Lessons Learned from 300mm Conversion for Next Generation Manufacturing," Proceedings of European IEEE/SEMI Semiconductor Manufacturing Conference, April 2000, Munich, SEMI Technical Publications, Mtn. View, CA.
2. M. Heyns, et al., "Advanced Wet and Dry Cleaning Coming Together for Next Generation," Solid State Technology, pp. 37-47, March 1999.
3. K. Wolke, et al., "Marangoni Wafer Drying Avoids Disadvantages of Spin Drying or Alcohol Rinse," Solid State Technology, August 1996, pp. 8790.
4. P.W. Mertens, et al., "A High-Performance Drying Method Enabling Clustered Single-Wafer Wet Cleaning," Digest of Technical Papers, 2000 Symposium on VLSI-Technology, pp. 56-57 (Widerkehr and Assoc., Gaithersburg, MD).
5. W. Fyen, et al., accepted for publication in Proceedings of Symposium on Ultra Clean Processing on Silicon Surfaces, Sept 2000, Oostende.