Characterization and optimization of LTCC for high density large area MCM's

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 92-97

  Richtarsic, M ^a   Thornton, J ^a  

^a LOCKHEED MARTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COST EFFECTIVENESS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONICS; MICROPROCESSOR CHIPS; MIXED SIGNAL INTEGRATED CIRCUITS; MULTICHIP MODULES; OPTIMIZATION; TEMPERATURE;

DESIGN ENHANCEMENT; ENVIRONMENTAL REQUIREMENT; FABRICATION PROCESS; INTEGRATION REQUIREMENTS; LOW-TEMPERATURE CO-FIRED CERAMICS; MILITARY ELECTRONICS; MILITARY SYSTEMS; PACKAGING TECHNIQUES;

CHARACTERIZATION;

EID: 79960008960     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670761     Document Type: Conference Paper

References (6)

1. W.A. Vitriol and J.I. Steinberg, "Development of a Low Temperature Cofired Ceramic Technology", Proceedings ISHM, pp. 593-598, 1983.
2. C.L. Haertling and D.J. Smith, "Fabrication Approaches for Surface Fine Line Metallization of LTCC Modules", International Journal of Microcircuits & Electronic Packaging, Vol. 18, No. 2, pp. 169-178, 1995.
3. AX. Kovacs and D.F. Elwell, "Integrated Brazed LTCC Packages", Proceedings of the International Conference on Multichip Modules", pp. 591-596, 1994.
4. J.L. Pedigo and N.J. Sudgen, "Printer's Primer". Hybrid Circuit Technology, 1992.
5. J.B. Thornton, P.L. Li, J.P. Page, R. Draudt, and R.L. Keusseyan, "SEM-E Hermetic-LTCC Road Map to Military Chip-On-Board", Proceedings ISHM, pp. 691-696, 1992.
6. R.L. Brown and M.R. Ehlert, "A Flexible Manufacturing Approach for Low-Temperature Cofired Ceramic MCM", Proceedings ISHM, pp. 7075, 1992.