SHEWMA: an end-of-line SPC scheme using wafer acceptance test data

IEEE Transactions on Semiconductor Manufacturing

Volumn 13, Issue 3, 2000, Pages 344-358

  Fan, Chin Min ^a,b   Guo, Ruey Shan ^a,b   Chang, Shi Chung ^a,b   Wei, Chih Shih ^c  

^a IEEE

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^c TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; MATHEMATICAL MODELS; PROBABILITY DENSITY FUNCTION; QUALITY CONTROL; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; STATISTICAL PROCESS CONTROL;

END OF LINE QUALITY CONTROL; EXPONENTIALLY WEIGHTED MOVING AVERAGE; SEQUENCE DISORDER; WAFER ACCEPTANCE TEST DATA;

SEMICONDUCTOR DEVICE TESTING;

EID: 0034248054     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.857945     Document Type: Article

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