Improvement in wafer temperature uniformity and flow pattern in a lamp heated rapid thermal processor

Journal of Crystal Growth

Volumn 217, Issue 1, 2000, Pages 201-210

  Yin, C P ^a   Hsiao, C C ^a   Lin, T F ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FLOW PATTERNS; FLOW VISUALIZATION; NUMERICAL ANALYSIS; TEMPERATURE MEASUREMENT; THERMAL GRADIENTS; THERMODYNAMIC PROPERTIES;

RAPID THERMAL PROCESSOR; TEMPERATURE UNIFORMITY;

SILICON WAFERS;

EID: 0034229935     PISSN: 00220248     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-0248(00)00450-4     Document Type: Article

References (21)

1. Özturk M.C., Sorrell F.Y., Wortman J.J., Johnson F.S., Grider D.T. IEEE Trans. Semicond. Manuf. 4:1991;155.
2. Detaton R., Massoud H.Z. J. Appl. Phys. 70:1991;3588.
3. Lord H.A. IEEE Trans. Semicond. Manuf. 1:1988;105.
4. Sorrell F.Y., Fordham M.J., Özturk M.C., Wortman J.J. IEEE Trans. Electron Devices. 36:1992;75.
5. Campbell S.A., Kanutson K.L., Liu B.Y.H., Leighton J.D. IEEE Trans. Semicond. Manuf. 4:1991;14.
6. Nenyei E., Sommer H., Gelpey J., Bauer A. Mat. Res. Soc. Symp. Proc. 342:1994;401.
7. Timans P.J., Morishige R.N., Wasserman Y. Mat. Res. Soc. Symp. Proc. 470:1997;57.
8. Young G.L., McDonald K.A. IEEE Trans. Semicond. Manuf. 3:1990;176.
9. Cho B.J., Kim C.K. J. Appl. Phys. 67:1990;7583.
10. Zollner J.P., Patzschke I., Pietzuch V., Pezoldt J., Eichhorn G. Mat. Res. Soc. Symp. Proc. 303:1993;177.
11. Kakoschke R., Bubmann E. Mat. Res. Soc. Symp. Proc. 146:1989;473.
12. Riley T.J., Gyurcsik R.S. Mat. Res. Soc. Symp. Proc. 303:1993;223.
13. Kakoshke R., Bubmann E., Foll H. Appl. Phys. A. 50:1990;141.
14. Cho Y.M., Paulraj A., Kailath T., Xu G.H. IEEE Trans. Semicond. Manuf. 7:1991;34.
15. Gongste J.F., Oosterlaken T.G.M., Bart G.C.J., Janssen G.C.A.M., Radelaar S. J. Appl. Phys. 75:1994;2830.
16. Lee K.C., Chang H.Y., Hu J.G. Mat. Res. Soc. Symp. Proc. 470:1997;187.
17. Vandenabeele P., Maex K. Mat. Res. Soc. Symp. Proc. 224:1991;185.
18. Hebb J.P., Jensen K.F., Egan E.W. Mat. Res. Soc. Symp. Proc. 387:1995;21.
19. Vandenabeele P., Maex K., De Keersmaecker R. Mat. Res. Soc. Symp. Proc. 146:1989;149.
20. Gyurcsik R.S., Riley T.J., Sorrell F.Y. IEEE Trans. Semicond. Manuf. 4:1991;9.
21. Moslehi M.M., Kuehne J., Yeakley R., Velo L., Najm H., Dostalik B., Yin D., Davis C.J. Mat. Res. Soc. Symp. Proc. 224:1991;143.