Monitoring transient liquid phase sintering of Cu-Sn alloys by thermal analysis

International Journal of Powder Metallurgy (Princeton, New Jersey)

Volumn 36, Issue 5, 2000, Pages 57-68

  Reyburn, Beth ^a   Corbin, Stephen ^b  

^a University of Washington   (United States)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; INTERDIFFUSION (SOLIDS); INTERMETALLICS; LIQUID PHASE EPITAXY; MELTING; MIXTURES; REACTION KINETICS; SINTERING; SOLIDIFICATION; THERMOANALYSIS;

TRANSIENT LIQUID PHASE SINTERING;

COPPER POWDER METALLURGY;

EID: 0034224901     PISSN: 08887462     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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