Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method

Microelectronics Reliability

Volumn 40, Issue 7, 2000, Pages 1147-1155

  Evans, John W ^a   Evans, Jillian Y ^b   Ghaffarian, Reza ^c   Mawer, Andrew ^d   Lee, Kyoung Taeg ^e   Shin, Chang Ho ^e  

^a Ajou University   (South Korea)

^b Daewoo Electronics Co   (South Korea)

^c CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^d MOTOROLA INC   (United States)

^e Institute for Advanced Engineering (IAE)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; MONTE CARLO METHODS; PRODUCT DEVELOPMENT;

BALL GRID ARRAYS (BGA);

ELECTRONICS PACKAGING;

EID: 0034224438     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00042-1     Document Type: Article

References (16)

1. Amagai M. Chip scale package (CSP) solder joint reliability and modeling. Proc IEEE IRPS, Reno, NV, 1998. p. 260-8.
2. Blish RC. Thermal cycling and thermal shock failure rate modeling. Proc IEEE IRPS, Denver, CO, 1997. p. 110-7.
3. Dasgupta A, Oyan C, Barker D, Pecht M. Solder creepfatigue analysis by an energy-partitioning approach. Trans ASME 1992;114:152-60.
4. Engelmaier W. Fatigue life of leadless chip carrier solder joints during power cycling. IEEE Trans Compon, Hybrids Manufact Technol 1983;6(3).
5. Engelmaier W, Attarwala AI. Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards. IEEE Trans Compon, Hybrids Manufact Technol 1989;12(2):284-96.
6. Engelmaier W. Environmental stress screening and use environments - their impact on surface mount solder joint reliability. Proc IEPS Conf, 1990.
7. Evans JW, Evans JY. Product integrity and reliability in design. Berlin: Springer, 2000.
8. Evans JW, Evans JY, Ryu BK. Designing and building-in reliability in advanced microelectronics assemblies and structures. IEEE Trans Compon, Packag Manufact Technol - Part A 1997;20(1).
9. Fuchs HO, Stephens RI. Metal fatigue in engineering. New York: Wiley, 1980.
10. Ghaffarian R. CBGA/PBGA package planarity and assembly reliability. 1997 International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium Proc, San Jose, 1997.
11. Ghaffarian R, Kim NP. Ball grid array reliability assessment for aerospace applications. IMAP 97, 1997.
12. Hagge JK. Predicting fatigue life of leadless chip carriers using Manson-Coffin equations. Proc IEPS Conf 1982. p. 199-208.
13. Lau JH, Pao YH. Solder joint reliability of BGA, CSP flip chip and fine pitch assemblies. New York: McGraw-Hill, 1997.
14. Mawer A, Luquette L. Interconnect reliability of ball grid array and direct chip attach. IRPS 1997 Tutorial, 1997.
15. O'Connor PDT. Practical reliability engineering. New York: Wiley, 1991.
16. Wild R. Some fatigue properties of solders and solder joints. IBM Report No 7AX00081, IBM Federal Systems Div, 1975.