Interface structure and formation mechanism of diffusion-bonded joints of SiC ceramic to TiAl-based alloy

Scripta Materialia

Volumn 43, Issue 1, 2000, Pages 49-53

  Liu, H J ^a   Feng, J C ^a   Qian, Y Y ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DIFFUSION; INTERFACES (MATERIALS); MICROANALYSIS; PHASE TRANSITIONS; PRESSURE EFFECTS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; THERMAL EFFECTS; TITANIUM ALLOYS; X RAY DIFFRACTION ANALYSIS;

DIFFUSION BONDING; ELECTRON PROBE MICROANALYSIS; FACE-CENTERED CUBIC (FCC) STRUCTURE; PARABOLIC LAW;

CERMETS;

EID: 0034207208     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(00)00360-2     Document Type: Article

References (11)

1. Naka M., Feng J.C., Schuster J.C. Metall. Mater. Trans. A. 28:1997;1385.
2. Feng J.C., Naka M., Schuster J.C. J. Mater. Sci. Lett. 16:1997;1116.
3. Feng J.C., Liu H.J., Li Z.R. Trans. Chin. Weld. Inst. 2:1997;20.
4. Fukai T., Naka M., Schuster J.C. Trans. JWRI. 1:1996;59.
5. Martinelli A.E., Drew R.A.L. Mater. Sci. Eng. A. 191:1995;239.
6. Backhaus-Ricoult M. Acta Metall. Mater. 40:1992;S95.
7. Holmquist M., Recina V., Ockborn J., Pettersson B., Zumalde E. Scripta Mater. 39:1998;1101.
8. Seto S., Matsumoto K., Masuyama T., Hiroshima M., Ishikawa H. Q. J. Jap. Weld. Soc. 16:1998;59.
9. T. Jungling, B. Kieback, W. Glatz, and H. Clemens, in Proceedings of the TMS '95 Annual Meeting on Gamma Titanium Aluminides, ed. Y. W. Kim, R. Wagner, and M. Yamaguchi, Nevada, p. 627 (1995).
10. H. A. Wickman and E. S. C. Chin, in Proceedings of the TMS '95 Annual Meeting on Gamma Titanium Aluminides, ed. Y. W. Kim, R. Wagner, and M. Yamaguchi, Nevada, p. 499 (1995).
11. Liu H.J., Feng J.C., Qian Y.Y., Li Z.R. J. Mater. Sci. Lett. 18:1999;1011.