Reliability testing on flip chip joining with isotropically-conductive adhesives

Journal of Electronics Manufacturing

Volumn 7, Issue 4, 1997, Pages 287-292

  Pennanen, Virpi ^a   Rusanen, Outi ^a  

^a NOKIA SIEMENS NETWORKS   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0004734419     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313197000300     Document Type: Article

References (4)

1. O. Rusanen and V. Pennanen, "Experience of working with thermosetting and thermoplastic conductive adhesives," 2nd International Conference on Adhesive Joining Technology in Electronics Manufacturing, Stockholm, 1996.
2. H. L. Hvims, "Conductive adhesives for SMT and potential applications," IEEE Transactions on Components, packaging and manufacturing Technology, 1995, pp. 284-291.
3. J. C. Jagt et al. "Electrically-conductive adhesives: A prospective alternative for SMD soldering," IEEE Transactions on Components, packaging and manufacturing Technology, 1995, pp. 292-298.
4. C. G. L. Khoo and J. Liu, "Moisture sorption in some popular conductive adhesives," Circuit World 22(4) 1996, pp. 9-15.