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Volumn 18, Issue 2, 2000, Pages 690-694
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Effect of post-nitride-passivation processing on the long-term stability of polysilicon integrated circuit resistors
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Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
CARRIER CONCENTRATION;
GRAIN BOUNDARIES;
HYDROGEN BONDS;
INTEGRATED CIRCUIT LAYOUT;
PASSIVATION;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SEMICONDUCTING SILICON;
TRANSMISSION ELECTRON MICROSCOPY;
LOW-PRESSURE CHEMICAL VAPOR DEPOSITION (LPCVD);
POLYSILICON RESISTORS;
POST-NITRIDE-PASSIVATION PROCESSING;
RESISTORS;
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EID: 0034156463
PISSN: 10711023
EISSN: None
Source Type: Journal
DOI: 10.1116/1.591260 Document Type: Article |
Times cited : (7)
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References (22)
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