Approaches to flip chip technology using electroless nickel - gold bumps

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1995, Pages 60-66

  Kloeser, Joachim ^a   Ostmann, Andreas ^a   Aschenbrenner, Rolf ^a   Zakel, Elke ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; DIES; ELECTROLESS PLATING; FLIP CHIP DEVICES; NICKEL COMPOUNDS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING; THERMAL CYCLING;

ADHESIVE INTERCONNECTIONS; CERAMIC SUBSTRATES; FLEXIBLE CIRCUIT MATERIALS; NICKEL GOLD BUMPS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0029461903     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)