Liquid encapsulated MCM package - thermal demonstration

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 258-265

  Lee, Tien Yu Tom ^a   Hause, Vern ^a   Mahalingam, Mali ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COOLING; ENCAPSULATION; HEAT FLUX; HEAT TRANSFER; MICROPROCESSOR CHIPS; MULTICHIP MODULES; PRESSURE EFFECTS;

CRITICAL HEAT FLUX; LIQUID ENCAPSULATED PACKAGES;

ELECTRONICS PACKAGING;

EID: 0029712126     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)