메뉴 건너뛰기




Volumn 40, Issue 3, 2000, Pages 507-516

Transient electro-thermal simulation of microsystems with space-continuous thermal models in an analogue behavioural simulator

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER HARDWARE DESCRIPTION LANGUAGES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MICROELECTRONIC PROCESSING;

EID: 0033894398     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(99)00251-6     Document Type: Article
Times cited : (7)

References (22)
  • 1
    • 0029313588 scopus 로고
    • Applications of thermal silicon sensors on membranes
    • Gajda MA, Ahmed H. Applications of thermal silicon sensors on membranes. Sensors Actuators A 1995;49:1-9.
    • (1995) Sensors Actuators A , vol.49 , pp. 1-9
    • Gajda, M.A.1    Ahmed, H.2
  • 3
    • 0004765983 scopus 로고    scopus 로고
    • FEM bei der Entwicklung eines Hall-ICs. Temperaturverteilung und parasitäre Effekte durch thermische Wellen
    • Munich, 4-5 March 1998
    • Moser H. FEM bei der Entwicklung eines Hall-ICs. Temperaturverteilung und parasitäre Effekte durch thermische Wellen. In: Proc. Numerische Simulation in Feinwerktechnik-/Mikrotechnik und Elektronik, Munich, 4-5 March 1998, 1998. p. B6.
    • (1998) Proc. Numerische Simulation in Feinwerktechnik-/Mikrotechnik und Elektronik
    • Moser, H.1
  • 4
    • 0017269965 scopus 로고
    • Computer simulation of integrated circuits in the presence of electrothermal interaction
    • Fukahori K, Gray PR. Computer simulation of integrated circuits in the presence of electrothermal interaction. IEEE J Solid State Circuits 1976;December:835-46.
    • (1976) IEEE J Solid State Circuits , vol.DECEMBER , pp. 835-846
    • Fukahori, K.1    Gray, P.R.2
  • 5
    • 0030247516 scopus 로고    scopus 로고
    • A rational formulation of thermal circuit models for electrothermal simulation. Part I: Finite element method
    • Hsu JT, Vu-Quoc L. A rational formulation of thermal circuit models for electrothermal simulation. Part I: finite element method. IEEE Trans Circuit Syst I 1996;43(9):721-32.
    • (1996) IEEE Trans Circuit Syst I , vol.43 , Issue.9 , pp. 721-732
    • Hsu, J.T.1    Vu-Quoc, L.2
  • 6
    • 0032043613 scopus 로고    scopus 로고
    • An efficient thermal simulation tool for ICs, microsystem elements and MCMs: The μS-THERMANAL
    • Csendes A, Szekely V, Rencz M. An efficient thermal simulation tool for ICs, microsystem elements and MCMs: the μS-THERMANAL Microelectron J 1998;29:241-55.
    • (1998) Microelectron J , vol.29 , pp. 241-255
    • Csendes, A.1    Szekely, V.2    Rencz, M.3
  • 7
    • 0001963238 scopus 로고    scopus 로고
    • An implementation of electrothermal component models in a general purpose circuit simulation program
    • Cannes, France, 1997
    • Veijola T, Costa L, Valtonen M. An implementation of electrothermal component models in a general purpose circuit simulation program. In: Proc. of THERMINIC '97, Cannes, France, 1997, 1997. p. 96-100.
    • (1997) Proc. of THERMINIC '97 , pp. 96-100
    • Veijola, T.1    Costa, L.2    Valtonen, M.3
  • 8
    • 8744276470 scopus 로고    scopus 로고
    • www.ise.com.
  • 11
    • 8744223305 scopus 로고    scopus 로고
    • www.analogy.com.
  • 12
    • 8744288603 scopus 로고    scopus 로고
    • www.mentorg.com/eldo/.
  • 13
    • 0026836993 scopus 로고
    • A Computer-aided design system for microelectromechanical systems (MEMCAD)
    • Senturia S. A Computer-aided design system for microelectromechanical systems (MEMCAD). IEEE J MEMS 1992;1(1):3-13.
    • (1992) IEEE J MEMS , vol.1 , Issue.1 , pp. 3-13
    • Senturia, S.1
  • 20
    • 8744314838 scopus 로고    scopus 로고
    • http://www.spec.org.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.