Integration of heat exchanger with high current hybrid power module

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 2173-2178

  Rodriguez, Pablo ^a   Fusaro, James M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003309789     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)

1. Fusaro, J. and Darveaux, R., "Reliability of Copper Baseplate High Current Power Modules", 1996 Proceedings of the International Symposium on Microelectronics", pp. 389-396.
2. Incropera, F.P. and DeWitt, D.P., Fundamentals of Heat and Mass Transfer, Second Edition, Wiley, New York, 1985.
3. Romero, G. and Martinez, J., "Development of Metal Matrix Composite Baseplate Technology for High Current Power Modules", Proceedings of the 1994 International Symposium on Microelectronics, pp. 421-426.
4. Romero, G., Fusaro, J. and Martinez, J., "Metal Matrix Composite Power Modules: Improvements in Reliability and Package Integration", Conference Record of the 1995 IEEE Industry Applications Society, Vol. I, pp. 916-922.
5. Scanlan, C. M., et al, "Advances in Metal Matrix Composites for Power Semiconductor Applications", Proceedings of the 1995 Winter Advanced Manufacturing Symposium, Motorola Internal Publication.
6. Soule, C. A., "Cooling high density electronics with liquid-cooled cold plates", Powertechnics Magazine, August 1988.
7. I-DEAS Master Series is a trade mark of Structural Dynamics Research Corp., Milford, Ohio