Copper deposition on micropatterned electrodes from an industrial acid copper plating bath

Journal of Applied Electrochemistry

Volumn 30, Issue 1, 2000, Pages 1-12

  Goldbach, S ^a   Van Den Bossche, B ^b   Daenen, T ^c   Deconinck, J ^b   Lapicque, F ^a  

^a UNIVERSITÉ DE LORRAINE   (France)

^b VRIJE UNIVERSITEIT BRUSSEL   (Belgium)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER COMPOUNDS; COPPER PLATING; CURRENT DENSITY; ELECTRIC CURRENT DISTRIBUTION; ELECTRODES; ELECTROPLATING SOLUTIONS; LAMINAR FLOW; MASS TRANSFER; SODIUM CHLORIDE; SULFURIC ACID; TURBULENT FLOW;

MICROPATTERNED ELECTRODES;

ELECTROPLATING;

EID: 0033880836     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1003847219784     Document Type: Article

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