Electrophoretic deposition [EPD] applied to reaction joining of silicon carbide and silicon nitride ceramics

Journal of Materials Science

Volumn 35, Issue 12, 2000, Pages 2913-2925

  Lessing, P A ^a   Erickson, A W ^a   Kunerth, D C ^a  

^a IDAHO NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHARGED PARTICLES; CRYSTAL MICROSTRUCTURE; ELECTRIC FIELD EFFECTS; HIGH TEMPERATURE EFFECTS; LIQUID METALS; MIXING; PARTICLE SIZE ANALYSIS; PRECIPITATION (CHEMICAL); SILICON CARBIDE; SILICON NITRIDE; THERMAL CYCLING;

ELECTROPHORETIC DEPOSITION; HIGH TEMPERATURE THERMAL CYCLES; REACTION BONDING;

ELECTRODEPOSITION;

EID: 0033720645     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004766424209     Document Type: Article

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