Transport properties of rapid solidified Fe-Si-Mn-Cu thermoelectric alloys

Journal of Alloys and Compounds

Volumn 306, Issue 1-2, 2000, Pages 303-306

  Zhao, X B ^a   Zhu, T J ^a   Hu, S H ^a   Zhou, B C ^a   Wu, Z T ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DOPING (ADDITIVES); ELECTRON TRANSPORT PROPERTIES; ELECTRONIC PROPERTIES; METALLOGRAPHIC PHASES; QUENCHING; RAPID SOLIDIFICATION; STOICHIOMETRY; THERMOELECTRICITY; X RAY DIFFRACTION ANALYSIS;

IRON SILICON MANGANESE COPPER ALLOYS; THERMOELECTRIC ALLOYS;

IRON ALLOYS;

EID: 0033716756     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-8388(00)00808-2     Document Type: Article

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