Effects of Cu addition on the β-phase formation rate in Fe2Si5 thermoelectric materials

Journal of Materials Science

Volumn 33, Issue 2, 1998, Pages 385-394

  Yamauchi, I ^a   Okamoto, H ^a,b   Suganuma, A ^a,b   Ohnaka, I ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Kurimoto Center for Innovative Technology Kurimoto   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COMPOSITION EFFECTS; COPPER; DIFFERENTIAL THERMAL ANALYSIS; REACTION KINETICS; SOLIDIFICATION; STACKING FAULTS; THERMAL EFFECTS; THERMOELECTRICITY; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

EUTECTOID REACTION;

IRON ALLOYS;

EID: 0031695955     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004323930521     Document Type: Article

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