Ball grid array type package by using of new encapsulation method

Proceedings of the International Electronics Packaging Conference

Volumn , Issue , 1995, Pages 577-587

  Kawahara, T ^a   Kasai, J ^a   Osawa, M ^a   Ishiguro, H ^a   Kato, Y ^a   Sakurai, Y ^a   Nakaseko, S ^a   Hozumi, T ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTRIC EQUIPMENT; ELECTRIC WIRE; ENCAPSULATION; HEAT RADIATION; METAL MOLDING; SEMICONDUCTOR DEVICE STRUCTURES;

BALL GRID ARRAY; SEMICONDUCTOR ELEMENT;

ELECTRONICS PACKAGING;

EID: 0029462266     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)