Integration of Pt/Ru electrode structures by metalorganic chemical-vapor deposition on poly-Si/SiO2/Si

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 1, 2000, Pages 262-266

  Choi, Eun Suck ^a   Yang, Jung Hwan ^a   Park, Jong Bong ^a   Yoon, Soon Gil ^a  

^a Chungnam National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTRODES; GRAIN BOUNDARIES; METALLORGANIC CHEMICAL VAPOR DEPOSITION; MULTILAYERS; PLATINUM; RUTHENIUM;

ELECTRODE STACK STRUCTURES; POLYSILICON;

DIELECTRIC FILMS;

EID: 0033699192     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.591181     Document Type: Article

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