A study of sub-Tg heat flow transition of cured epoxy resin

Polymer Engineering and Science

Volumn 38, Issue 6, 1998, Pages 947-953

  Xiangxu, Chen ^a   Shanjun, L I ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COOLING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; GLASS TRANSITION; MOLECULAR DYNAMICS; RESIDUAL STRESSES; STRESS RELAXATION;

DIGLYCIDYL BISPHENOL ETHER; HEAT FLOW TRANSITION;

EPOXY RESINS;

EID: 0032083463     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.10262     Document Type: Article

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