Innovation of the fore pump and roughing pump for high-gas-flow semiconductor processing

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 6, 1999, Pages 3505-3508

  Akutsu, Isao ^a   Ohmi, Tadahiro ^a,b  

^a Diavac Limited   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0033458419     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582091     Document Type: Article

References (7)

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3. S. Liqun, Z. Yue, W. Xiaozhen, and P. Shinjin, J. Vac. Sci. Technol. A 11, 704 (1993).
4. I. Akutsu and M. Ozak, United States Patent No. 5,829,957.
5. I. Akutsu, Japanese Patent No. 9-4580.
6. Y. Chinzei, T. Ichiki, R. Kurosaki, J. Kikuchi, N. Ikegami, T. Fukazawa, H. Shindo, and Y. Horike, Jpn. J. Appl. Phys., Part 1 35, 2472 (1996).
7. T. Ohmi, K. Aizawa, and I. Akutsu, Japanese Patent No. 8-315524.