Test and reliability: partners in IC manufacturing, Part 1

IEEE Design and Test of Computers

Volumn 16, Issue 3, 1999, Pages 64-71

  Hawkins, Charles F ^b   Segura, Jaume ^a  

^a UNIVERSITAT DE LES ILLES BALEARS   (Spain)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; DESIGN FOR TESTABILITY; ELECTROMIGRATION; FAILURE ANALYSIS; INTEGRATED CIRCUIT TESTING; OXIDES; RELIABILITY; SERVICE LIFE; STRESSES; THERMAL EXPANSION; WEAR OF MATERIALS;

PRODUCT LIFE; RELIABILITY FAILURES; STRESS TESTING; WEAROUT MECHANISMS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033360553     PISSN: 07407475     EISSN: None     Source Type: Journal    
DOI: 10.1109/54.785836     Document Type: Article

References (11)

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2. "Stress-Induced Phenomena in Metallization," Int'l Stress Void Workshops (American Institute of Physics), various years.
3. Proc. IEEE Int'l Reliability Physics Symp., various years.
4. J. Lloyd, "Topical Review: Electromigration in Thin Film Conductors," Semiconductor Science Technology, Vol. 12, 1997, pp. 1,177-1,185.
5. D. Pierce and P.G. Brusius, "Electromigration: A Review," Microelectronics Reliability, Vol. 37, No. 7, 1997, pp. 1,053-1,072.
6. J.R. Black, "Mass Transport of Aluminum by Momentum Exchange With Conducting Electrons," Proc. Int'l Reliability Physics Symp., 1967, pp. 148-159.
7. I.A. Blech and E.S. Meieran, "Electromigration in Thin Aluminum Films," J. Applied Physics, Vol. 40, No. 2, 1968, pp. 485-491.
8. S. Rauch and T. Sullivan, "Modeling Stress-Induced Void Growth in AL-4 wt % Cu Lines," Proc. SPIE, Vol. 1,805, 1993, pp. 197-208.
9. N. McCusker, H. Gamble, and B. Armstrong, "Surface Electromigration in Copper Interconnects," Int'l Reliability Physics Symp., 1999.
10. W.N. Needham, C. Prunty, and E.H. Yeoh, "High Volume Microprocessor Test Escapes, an Analysis of Defects Our Tests Are Missing," Int'l Test Conf., Los Alamitos, Calif., CS Press, Oct. 1998, pp. 25-34.
11. DDQ Testing in CMOS ICs, R.K. Gulati and C.F. Hawkins, eds. Kluwer Academic Publishing, Norwall, Mass., 1993.