Conformai, electroless copper and nickel deposition on MEMS structures

Materials Research Society Symposium - Proceedings

Volumn 546, Issue , 1999, Pages 139-144

  Neves, Hercules P ^a   Kudrle, Thomas D ^a   Chen, Jia Ming ^a   Adams, Scott G ^b   Maharbiz, Michel ^c   Lopatin, Sergey ^d   MacDonald, N C ^a  

^a Cornell University   (United States)

^b Kionix Inc   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CHEMICAL ACTIVATION; COPPER PLATING; DEPOSITION; ELECTROLESS PLATING; METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; NICKEL PLATING;

CONFORMAL ELECTROLESS DEPOSITION;

MICROELECTROMECHANICAL DEVICES;

EID: 0033356294     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)

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